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TD004

It is made of PET as the substrate and coated with hot melt adhesive and pressure sensitive adhesive on both sides. It has high viscosity, acid and alkali resistance, and be suitable for semiconductor and glass grinding.

Features
Product parameter
Features

Great peeling force


Acid and alkali resistance


Tear without residual glue


厚度(μm)寬度(mm)180°剝離(g/25mm)常溫持粘(Hr)耐水煮耐堿
180±101360/1560H0tmelt:>5000,Psa:>1800>72hrPASSPASS

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